This symposium will introduce Direct Atomic Layer Processing (DALP) as a localized atomic layer deposition platform for rapid materials discovery, functional thin-film engineering, and device-oriented nanofabrication. The first talk will focus on how DALP enables spatially controlled deposition, combinatorial material screening, and accelerated optimization of functional materials with controlled thickness, composition, and architecture. The second talk will present selected application areas where DALP can support advanced device development, including optics, MEMS, sensors, microelectronics, advanced packaging, and catalysis. Together, the session will highlight how programmable atomic-layer processing can support faster experimentation, localized processing, and scalable implementation of functional materials in device-relevant applications.