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This lecture series provides a comprehensive overview of advanced electron microscopy techniques, focusing on the underlying physical principles, methodological workflows, sample preparation strategies, artifact control, and applied case studies in both materials and life sciences. Designed with a strictly educational scope, the curriculum bridges fundamental theory and high-resolution characterization across three core analytical modalities.
The first part examines Scanning Electron Microscopy (SEM), detailing microstructural characterization, low-voltage imaging of beam-sensitive and insulating specimens, and advanced contrast mechanisms utilizing secondary and backscattered electrons. Furthermore, it addresses analytical workflows such as EDS and EBSD, automated large-area acquisition, in-situ testing, cryogenic transfer, and correlative Raman-SEM analyses across diverse material classes, from polymers to semiconductor devices.
The second part addresses Volume Electron Microscopy (VEM), exploring three-dimensional ultrastructural imaging for cell biology, connectomics, pathology, and microelectronic reverse engineering. Methodological emphasis is placed on serial sectioning, large-area montaging, quantitative volumetric segmentation, and multi-scale correlative workflows combining light and electron microscopy.
The final part covers Focused Ion Beam (FIB) Dual Beam technologies, concentrating on site-specific cross-sectioning, transmission electron microscopy (TEM/STEM) lamella preparation via in-situ lift-out, and serial sectioning tomography. Additionally, it highlights advanced applications including micromechanical testing pillar fabrication, atom probe tomography specimen preparation, direct-write milling, and localized nanofabrication.
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